美国采购需求：半导体设备

I'm interested in sourcing an automatic multi-chip bonder for LED package production to replace our existing unit. We typically integrate 9-16 different LED die types in a single package, with die sizes ranging from 0.30mm to 2mm. We're currently using epoxy die adhesive and prefer a dispensing method. The ceramic substrate size we work with is 59mm x 74mm, and we require placement accuracy around 10 microns, though 15 microns is acceptable for a more cost-effective solution. For tape handling, we use 4” and 6” chip on wafer tapes (8” capability would be a plus but not critical) and waffle/gel packs in 2”x2” and 4”x4”. This setup is for R&D purposes, so speed is not our primary concern; a throughput of 400-1,000 UPH would be ideal. Please send over brochures and pricing details for suitable machines that meet these specifications.